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Wafer Pick and Place Machine HJC-560

1. Can be used with 6-inch/8-inch Wafer ring input and tape&reel output; Can be wafer in waffle out.
2. Pick with one nozzle from wafer ring to carrier tape;
3. Mapping function is optional;
4. For 1.0 × 1.0 (mm) to 12 × 12 (mm) size die;
5. Suitable for QFN, CSP, TO-CAN etc;
6. Carrier tape rail width adjustable. Tape and reel module has X/Y axis;
7. HMI software has English language

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Features:

  1. Can be used with 6-inch/8-inch Wafer ring input and tape&reel output; (12inch can be customized)
    2. Pick with one nozzle from wafer ring to carrier tape;
    3. Mapping function is optional;
    4. For 1.0 × 1.0 (mm) to 12 × 12 (mm) size die; (other size can be customized)
    5. Suitable for QFN, CSP, TO-CAN etc;
    6. Carrier tape rail width adjustable;
    7. HMI software has English language.

 

 

 

 

 

Contents

Parameters

Machine overall size

1300×1200×1650 (L×W×H)

Input voltage

AC  220V  50Hz

Maximum power

3KW

Weight

800KG

Input air supply pressure

0.4~0.7 Mpa

Air pressure consumption

50~120L/min

UPH

2000Pcs/H (CT1.2 S)

Swing yield

99

Mechanism positioning accuracy

XY axis ± 0.01mm, rotation axis ± 0.05 °

Operation mode

Manual loading and unloading, automatic reclaiming and swinging

Material conveying mode

Linear motor

Control mode

Integrated control

Startup mode

Button start

Parameter setting mode

Screen settings

Abnormal alarm mode

Buzzer+screen display+three color indicator

 Options:

  1. can be from wafer to wafer, wafer to JEDEC tray/waffle tray, wafer to tape&reel.
  2. can be used with mapping file
  3. other function can be customized

please contact sales for more video

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