Wafer Pick and Place Machine HJC-560
1. Can be used with 6-inch/8-inch Wafer ring input and tape&reel output; Can be wafer in waffle out.
2. Pick with one nozzle from wafer ring to carrier tape;
3. Mapping function is optional;
4. For 1.0 × 1.0 (mm) to 12 × 12 (mm) size die;
5. Suitable for QFN, CSP, TO-CAN etc;
6. Carrier tape rail width adjustable. Tape and reel module has X/Y axis;
7. HMI software has English language
Wafer to dicing tape|wafer tape and reel|bare die tape and reel machine|die sorting machine|wafer to waffle tray|die bonding
Features:
- Can be used with 6-inch/8-inch Wafer ring input and tape&reel output; (12inch can be customized)
2. Pick with one nozzle from wafer ring to carrier tape;
3. Mapping function is optional;
4. For 1.0 × 1.0 (mm) to 12 × 12 (mm) size die; (other size can be customized)
5. Suitable for QFN, CSP, TO-CAN etc;
6. Carrier tape rail width adjustable;
7. HMI software has English language.
Contents |
Parameters |
Machine overall size |
1300×1200×1650 (L×W×H) |
Input voltage |
AC 220V 50Hz |
Maximum power |
3KW |
Weight |
800KG |
Input air supply pressure |
0.4~0.7 Mpa |
Air pressure consumption |
≈50~120L/min |
UPH |
≥2000Pcs/H (CT≥1.2 S) |
Swing yield |
≥99% |
Mechanism positioning accuracy |
XY axis ± 0.01mm, rotation axis ± 0.05 ° |
Operation mode |
Manual loading and unloading, automatic reclaiming and swinging |
Material conveying mode |
Linear motor |
Control mode |
Integrated control |
Startup mode |
Button start |
Parameter setting mode |
Screen settings |
Abnormal alarm mode |
Buzzer+screen display+three color indicator |
Options:
- can be from wafer to wafer, wafer to JEDEC tray/waffle tray, wafer to tape&reel.
- can be used with mapping file
- other function can be customized
please contact sales for more video