Wafer Pick and Place Machine HJC-560
1. Can be used with 6-inch/8-inch Wafer ring input and tape&reel output; Can be wafer in waffle out.
2. Pick with one nozzle from wafer ring to carrier tape;
3. Mapping function is optional;
4. For 1.0 × 1.0 (mm) to 12 × 12 (mm) size die;
5. Suitable for QFN, CSP, TO-CAN etc;
6. Carrier tape rail width adjustable. Tape and reel module has X/Y axis;
7. HMI software has English language
Wafer to dicing tape|wafer tape and reel|bare die tape and reel machine|die sorting machine|wafer to waffle tray|die bonding
Features:
- Can be used with 6-inch/8-inch Wafer ring input and tape&reel output; (12inch can be customized)
2. Pick with one nozzle from wafer ring to carrier tape;
3. Mapping function is optional;
4. For 1.0 × 1.0 (mm) to 12 × 12 (mm) size die; (other size can be customized)
5. Suitable for QFN, CSP, TO-CAN etc;
6. Carrier tape rail width adjustable;
7. HMI software has English language.
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Contents |
Parameters |
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Machine overall size |
1300×1200×1650 (L×W×H) |
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Input voltage |
AC 220V 50Hz |
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Maximum power |
3KW |
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Weight |
800KG |
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Input air supply pressure |
0.4~0.7 Mpa |
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Air pressure consumption |
≈50~120L/min |
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UPH |
≥2000Pcs/H (CT≥1.2 S) |
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Swing yield |
≥99％ |
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Mechanism positioning accuracy |
XY axis ± 0.01mm, rotation axis ± 0.05 ° |
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Operation mode |
Manual loading and unloading, automatic reclaiming and swinging |
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Material conveying mode |
Linear motor |
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Control mode |
Integrated control |
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Startup mode |
Button start |
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Parameter setting mode |
Screen settings |
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Abnormal alarm mode |
Buzzer+screen display+three color indicator |
Options:
- can be from wafer to wafer, wafer to JEDEC tray/waffle tray, wafer to tape&reel.
- can be used with mapping file
- other function can be customized
please contact sales for more video